Monday, February 28, 2011

The latest Electronic Component and Ic Component Technologies Enable Innovative Medical Devices

New electronic component echnologies with advanced capabilities and features are
enabling the development of smaller medical devices, as well as the creation of
technologies for faster and more compact imaging systems. Significant new Ic components
include low-power parts, real-time digital signal processors (DSP), FPGA control and
fiber optics. Also, advanced technologies such as wireless, GPS, Smartphone and
machine-to-machine interface are having a transformative impact on the medical device
industry.
New low-power components combined with new circuitry and battery technology enable
enhanced development of innovative handheld and portable medical devices. These
component and system improvements extend battery life, reduce product size, lower
costs, increase safety and require fewer battery changes throughout the lifetime of a
device. TechEn's customers often use low-power components, such as PIC XLP MCUs or TI
MSP 430 parts to achieve this most important capability and to differentiate their
products in the marketplace.

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